Semiconductor Components Technologies

Semiconductor Components Technologies Semiconductor Components Technologies Semiconductor Components Technologies

Semiconductor Components Technologies

Semiconductor Components Technologies Semiconductor Components Technologies Semiconductor Components Technologies

IC Components & Assembly Solutions

IC Components & Assembly SolutionsIC Components & Assembly SolutionsIC Components & Assembly Solutions

"The bitterness of poor quality remains long after the sweetness of low price is forgotten."

Benjamin Franklin

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Products

Thermal Management: Manufacturer's Representative for Sumitomo Electric / ALMT

World's benchmark for Quality, Performance & Value

Advanced Thermal Management Materials with Adjustable CTE


MATERIALS: Tungsten Copper (CuW or WCu), Molybdenum Copper (CuMo or MoC)

Diamond  Composites, Silver Diamond (Ag Dia), Copper Diamond (Cu Dia), *Aluminum Diamond (Al DIa), Pure Tungsten and Molybdenum. Thermkon equivalents. CPC, *CMC (CuMoCu, Copper Moly Copper).

Magnesium Silicon Carbide (MgSiC)

  

TYPES: Heat Spreader, Heatspreader, Heat Sink, Heatsink, Flange, Carrier, Base, Submount, Flip Chip Lid, Shim, Coin…


Excellent Thermal Conductivity of up to 2,000 W/mK and Low CTE

Hermetic Packages, and Substrates

OPTO, OPTICAL, OPTOELECTRONIC, PHOTONIC, POWER, MICROWAVE, RF, IMAGING, IR, PACKAGES TYPES: Butterfly, Mini-DIL, TOSA / ROSA...

Metallized Substrates & Pressed Ceramic

TYPES: Thin Film, DPC / Direct Plate Copper, CPU / Copper Plate Up, DBC / Direct Bond Copper, Thick Film


SUBSTRATE MATERIALS: AlN, Alumina Nitride, *Alumina, *Alumina Oxide, *Al2O3, *LTCC, *BeO, *AlSiC, *Aluminum Silicon Carbide


APPLICATIONS: Laser & LED Submount, VCSEL, Insulator, Heat Sink, Base, Probe Card… 

Mixed Assembly Services, Wire bond, die attach, smt board as

Wire Bond, Ribbon Bond, Die Attach

Wire Bonding, Ribbon Bonding, Die Attach, Die Shear & Wire Pull Test

SMT Surface Mount Technology, Flip Chip & BGA

Flip Chip, Solder Bump, Stud Bump, Underfill, Column Grid Array, BGA, BGA Re-Work, Ball Grid Array,  Solder Paste Print, Component Placement, Reflow Solder, Wave Solder 

CNC Precision Metal Machining, Wire EDM, Milling, Turning, Grinding, Casting & Mold, Water Jet

5 axis, 4 axis CNC

Mori Seiki, Okuma, Hass, Starrag Heckerty, Kafo


 Casting quality to AMS STD 2175 


Heat Treat, Thermal Spray and Fuse


Foundry in No Bake or Air Set: large castings of high quality, permanent mold, supporting higher quantities supporting defense industry



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ITAR Compliant, *ISO 9001, *ISO 14001, *AS9100, *Veteran Owned

(*please inquire for details)

Semiconductor Components Technologies

e-mail: support@iccompo.com

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