IC Components & Assembly Solutions
"The bitterness of poor quality remains long after the sweetness of low price is forgotten."
Benjamin Franklin
"The bitterness of poor quality remains long after the sweetness of low price is forgotten."
Benjamin Franklin

World's benchmark for Quality, Performance & Value
Advanced Thermal Management Materials with Adjustable CTE
MATERIALS: Tungsten Copper (CuW or WCu), Molybdenum Copper (CuMo or MoC)
Diamond Composites, Silver Diamond (Ag Dia), Copper Diamond (Cu Dia), *Aluminum Diamond (Al DIa), Pure Tungsten and Molybdenum. Thermkon equivalents. CPC, *CMC (CuMoCu, Copper Moly Copper).
Magnesium Silicon Carbide (MgSiC)
TYPES: Heat Spreader, Heatspreader, Heat Sink, Heatsink, Flange, Carrier, Base, Submount, Flip Chip Lid, Shim, Coin…
Excellent Thermal Conductivity of up to 2,000 W/mK and Low CTE

OPTO, OPTICAL, OPTOELECTRONIC, PHOTONIC, POWER, MICROWAVE, RF, IMAGING, IR, PACKAGES TYPES: Butterfly, Mini-DIL, TOSA / ROSA...

TYPES: Thin Film, DPC / Direct Plate Copper, CPU / Copper Plate Up, DBC / Direct Bond Copper, Thick Film
SUBSTRATE MATERIALS: AlN, Alumina Nitride, *Alumina, *Alumina Oxide, *Al2O3, *LTCC, *BeO, *AlSiC, *Aluminum Silicon Carbide
APPLICATIONS: Laser & LED Submount, VCSEL, Insulator, Heat Sink, Base, Probe Card…

Wire Bonding, Ribbon Bonding, Die Attach, Die Shear & Wire Pull Test

Flip Chip, Solder Bump, Stud Bump, Underfill, Column Grid Array, BGA, BGA Re-Work, Ball Grid Array, Solder Paste Print, Component Placement, Reflow Solder, Wave Solder

5 axis, 4 axis CNC
Mori Seiki, Okuma, Hass, Starrag Heckerty, Kafo
Casting quality to AMS STD 2175
Heat Treat, Thermal Spray and Fuse
Foundry in No Bake or Air Set: large castings of high quality, permanent mold, supporting higher quantities supporting defense industry
(*please inquire for details)
e-mail: support@iccompo.com