Products
Thermal Management: Manufacturer's Representative for Sumitomo Electric / ALMT
World's benchmark for Quality, Performance & Value
MATERIALS: Tungsten Copper (CuW or WCu), Molybdenum Copper (CuMo or MoC)
Diamond Composites, Silver Diamond (AgDia), Pure Tungsten and Molybdenum. Thermkon equivalents.
Magnesium Silicon Carbide (MgSiC)
TYPES: Heat Sink, Heat Spreader, Flange, Carrier, Base, Submount, Flip Chip Lid, Shim…
Excellent Thermal Conductivity of up to 2,000 W/mK and Low CTE
Hermetic Packages, and Substrates
OPTO, OPTICAL, OPTOELECTRONIC, PHOTONIC, POWER, MICROWAVE, RF, IMAGING, IR, PACKAGES TYPES: Butterfly, Mini-DIL, TOSA / ROSA...
Metallized Substrates & Pressed Ceramic
TYPES: Thin Film, DPC / Direct Plate Copper, CPU / Copper Plate Up, DBC / Direct Bond Copper, Thick Film
SUBSTRATE MATERIALS: AlN, Alumina Nitride, Alumina, Alumina Oxide, Al2O3, LTCC, BeO
APPLICATIONS: Laser & LED Submount, VCSEL, Insulator, Heat Sink, Probe Card…
Mixed Assembly Services, CNC Precision Metal Machining, Wire EDM, Milling, Turning, Grinding, Casting & Mold
Wire Bond, Ribbon Bond, Die Attach
Wire Bonding, Ribbon Bonding, Die Attach, Die Shear & Wire Pull Test
SMT Surface Mount Technology, Flip Chip & BGA
Flip Chip, Solder Bump, Stud Bump, Underfill, Column Grid Array, BGA, BGA Re-Work, Ball Grid Array, Solder Paste Print, Component Placement, Reflow Solder, Wave Solder
CNC Precision Metal Machining, Wire EDM, Milling, Turning, Grinding, Casting & Mold, Water Jet
5 axis, 4 axis CNC
Mori Seiki, Okuma, Hass, Starrag Heckerty, Kafo
Casting quality to AMS STD 2175
Heat Treat, Thermal Spray and Fuse
Foundry in No Bake or Air Set: large castings of high quality, permanent mold, supporting higher quantities supporting defense industry
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